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  • PCB

    Main items  "1 DAY and up"

    Characteristics
    Can be manufactured as single-sided, double-sided or multilayer PCB.
    PRIKEN handles a wide range of materials, including CEM-3, FR-4 and specialized materials as well as OSP(Organic surface protectant), HAL(Hot air leading), Gold plating, metal plating and more.

    BVH/IVH multilayer "3 DAYS and up"

    Characteristics
    Only the layers required are connected in these multilayer PCBs, without drilling holes completely through the board.

    BVH/IVH multilayer

    COB (Chip on Board) "3 DAYS and up"

    Characteristics
    Semiconductor chips are built directly into the board and are connected with pads and wire bonding.

    COB (Chip on Board)

    Semi-circular through hole(cut through hole)  "2 DAYS and up"

    Characteristics
    A PCB with plated through holes on the edge of the board.

    Semi-circular	through hole(cut through hole)

    Semi-circular	through hole(cut through hole)

    Controlled impedance

    Characteristics
    In this PCB, the electrical impedance caused by the circuit patterns and the input and output of electronic components is controlled by regulating the width of the signal lines, the thickness of the insulating layers and the board material's dielectric constant.

    Controlled impedance

    Hole-sealing technology using ink

    Characteristics
    A PCB where vias are permanently filled and plated over, making it possible to mount a component on the surface in the same place.
    ・Wiring density is increased 20-30% over traditional circuit boards.
    ・Also useful when creating multilayer PCBs.
    Manufacturing process
    Drill hole → plate hole → hole sealing with ink → plate over → etch → …

    Hole-sealing technology using ink

    Cavity (embedded component)

    Characteristics
    The board is machined without piercing through to the other side. Cavities can be created for the mounting of components.

    Cavity

    Silver through hole "3 DAYS and up"

    Characteristics
    A board featuring very high connection durability due to through holes being filled with silver paste.

    Silver through hole

    Aluminium base board "2 DAYS and up"

    Characteristics
    A PCB designed for the heat radiated by LED lighting and other sources.
    ・As the board is metal, it is extremely stiff and strong, while also very heavy (approximately 1.6 times that of FR-4).
    ・Also provides superb heat conduction, with the merit of excellent heat radiation.
    Example specifications
    Copper 35~105μm
    Insulation layer 80~120μm *Please consult with us.
    PCB thickness 1.0~2.0mm
    Example uses
    Power module PCBs, power supply switching PCBs, automotive power PCBs, PCBs equipped with LEDs, etc.

    Single-sided aluminum base

    Single-sided aluminum base

    HDI(High density interconnects) build-up "3 days or more"

    Characteristics
    A PCB the enables very high density.

    HDI(High density interconnects) build-up

    RF board(Ratio frequency)

    Characteristics
    Minimum loss of high frequencies.
    Example specifications
    Teflon, PPE, etc.
    Example uses
    Mobile, BS/CS tuners, GPS, Navigation, etc.

    Halogen-free

    Characteristics
    A PCB developed with consideration for the environment. Reduces the amount of toxic substances released when incinerated for recycling.

    *Delivery times may vary depending on PCB specifications.